Priya Sainz-Nieto

Designed a multilayer DSP-based embedded hardware platform for real-time signal-processing applications in Altium Designer. Completed schematic capture, component placement, PCB layout, design-rule definition, and manufacturing-release preparation. Implemented controlled-impedance routing and differential-pair constraints with length matching and optimized return paths. Applied mixed-signal PCB partitioning, grounding strategy, and EMI mitigation; supported design reviews, prototype bring-up, debugging, and signal validation.

Designed and supported high-density embedded electronics for an autonomous drone platform with processor, memory, communications, and control circuitry. Integrated Viking DDR4T08G72AZR2C-X1 DDR4 into a processor-centric architecture and developed DDR routing constraints for impedance control, length matching, differential-pair routing, byte-lane management, and return-path optimization. Built multilayer stackups with power distribution, grounding, and decoupling strategies; performed placement/routing in space-constrained designs and applied SI/PI practices to improve reliability.

Led development of precision multi-channel data-acquisition hardware with low-noise analog front ends and MCU-based processing. Optimized grounding, return paths, decoupling, filtering, ADC signal integrity, and mixed-signal PCB partitioning. Managed prototype bring-up, supply-rail verification, signal measurement, timing validation, hardware debugging, and manufacturing handoff. Partnered with firmware and test teams to resolve timing, signal integrity, EMI, and interface stability issues. Defined DFM/DFT strategies including test-point planning and manufacturability improvements; supported BOM optimization and long-term component sourcing.