YESSIN BOUZIDI

Led end-to-end design of a 3U CubeSat ADCS electronics system, translating mission constraints (pointing accuracy, orbital conditions, power budget, thermal loads, radiation effects) into hardware and firmware. Designed a 4-layer multilayer ADCS PCB integrating power regulation, sensor interfaces, signal conditioning, and protection circuits. Built reliability features such as watchdog and fault-tolerant firmware strategies, and performed system validation and signal integrity checks using Proteus, LTspice, PSpice for TI, ANSYS AEDT, and Saturn PCB Toolkit. Developed modular STM32 firmware for real-time sensor acquisition, fusion, and telemetry processing. Created a hardware-in-the-loop prototype with an STM32 Discovery board for debugging and validation.

Designed mechanical parts and enclosures in SolidWorks under functional and manufacturing constraints, including structural validation (stress, interference, weight distribution). Optimized FDM 3D printing parameters (PLA, PETG, ABS) for functional prototypes. Conducted physical testing and iterative refinement, and integrated mechanical structures with embedded electronics for multidisciplinary prototypes.

Designed a high-precision EEG analog front-end (AFE) acquisition PCB using the TI ADS1299, including signal conditioning, power filtering, and ESD protection to preserve biomedical signal integrity and safety. Developed an alternative EEG AFE architecture and compared performance through schematic design, PCB layout, analog simulation, and benchmarking metrics such as SNR/CMRR. Completed the full hardware lifecycle: schematic capture, PCB routing, assembly, functional validation testing. Implemented ESP32 firmware for SPI-based EEG acquisition and wireless transmission, and validated system behavior under biomedical noise conditions.